Multispectral Optical camera communication links based on spectral signature multiplexing

  1. Moreno, Daniel 2
  2. Guerra, Victor 3
  3. Rufo, Julio 1
  4. Rabadan, Jose 2
  5. Perez‐Jimenez, Rafael 2
  1. 1 Higher Polytechnic School of Engineering and Technology Universidad de La Laguna (ULL) San Cristóbal de La Laguna Santa Cruz de Tenerife Spain
  2. 2 Institute for Technological Development and Innovation in Communications (IDeTIC) Universidad de las Palmas de Gran Canaria (ULPGC) Las Palmas de Gran Canaria Las Palmas Spain
  3. 3 Pi Lighting Sarl Sion Valais Switzerland
Aldizkaria:
IET Optoelectronics

ISSN: 1751-8768 1751-8776

Argitalpen urtea: 2023

Mota: Artikulua

DOI: 10.1049/OTE2.12090 GOOGLE SCHOLAR lock_openSarbide irekia editor

Beste argitalpen batzuk: IET Optoelectronics

Garapen Iraunkorreko Helburuak

Laburpena

Optical camera communication is foreseen to have an essential role in future systems requiring wireless communication capability. In this regard, high-spectral-resolution cameras, such as multispectral (MS) cameras, present specific characteristics that can be exploited to provide new features to optical camera communication links. Using the MS cameras' features to take advantage of the light-emitting diode (LED) behaviour in a novel communication scheme is focussed. Notably, LED spectral response curves are different when their temperature changes. Therefore, these differences can be detected based on the MS cameras' spectral resolution. Thus, more than one communication channel can be attained using the same LED device since the camera can distinguish the different LED spectral signatures. This new approach is analysed in this work, including some equalisation techniques applied to the channel matrix in the receiver to improve the extraction of the transmitted signal reducing the inter-channel interference. For the specific MS camera employed in the experiments, up to two distinct channels could be obtained with the same transmitter at different temperatures, getting a bit error rate below the forward error correction limit. However, obtaining satisfactory results is highly dependent on the variation that temperature causes in the spectral signatures of the LEDs, so further experiments are recommended in future work with different devices.

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Erreferentzia bibliografikoak

  • 10.3390/app9204367
  • 10.1109/jlt.2020.3043046
  • 10.1109/tmc.2019.2913832
  • 10.1109/jlt.2021.3073656
  • 10.1364/oe.449860
  • Arai S., (2007), 2007 IEEE 66th Vehicular Technology Conference, pp. 2174, 10.1109/VETECF.2007.456
  • Iwase D., (2014), 2014 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), pp. 336, 10.1109/APCCAS.2014.7032788
  • 10.1016/j.optcom.2020.125451
  • 10.3390/electronics10030262
  • 10.1364/ol.449207
  • 10.3390/electronics9091339
  • 10.1109/access.2020.2976537
  • 10.1364/oe.433053
  • 10.1364/oe.24.024567
  • 10.1109/lpt.2021.3078842
  • 10.1109/jsac.2015.2432511
  • Hussein Y.S., (2016), 2016 IEEE 12th International Colloquium on Signal Processing its Applications (CSPA), pp. 204, 10.1109/CSPA.2016.7515832
  • Anusree A., (2016), 2016 International Conference on Wireless Communications, Signal Processing and Networking (WiSPNET), pp. 43, 10.1109/WiSPNET.2016.7566085
  • Jha M.K., (2020), 2020 2nd PhD Colloquium on Ethically Driven Innovation and Technology for Society (PhD EDITS), pp. 1
  • 10.1016/0031‐8914(67)90062‐6
  • Raypah M.E., (2016), 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) 18th Electronics Materials and Packaging (EMAP) Conference, pp. 1
  • 10.1109/ted.2016.2556079
  • Andonova A., (2011), Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), pp. 274, 10.1109/ISSE.2011.6053872
  • Chan C.‐J., (2016), 2016 International Conference on Electronics Packaging (ICEP), pp. 62, 10.1109/ICEP.2016.7486783
  • Becirovic V., (2019), 2019 18th International Symposium INFOTEH‐JAHORINA (INFOTEH), pp. 1